The Bostik Born2Bond UV-CIPG Gasketing range comprises UV-cured gaskets, formed in place, designed for industrial applications requiring sealing, precision, and rapid production.
The Bostik Born2Bond UV-CIPG Gasketing range, for UV Cure-In-Place Gasket, allows a gasket to be created directly on a part or housing through controlled dispensing, and then immediately cured under UV light. This approach stands apart from cut, moulded or manually assembled gaskets, which may require dedicated tooling, moulds, ovens or longer fitting operations.
These solutions are particularly suitable for production environments where components are becoming more compact, geometries more complex, and sealing requirements higher. They enable the formation of flexible, compression-resistant seals that can contribute to protection against water, dust, temperature variations, and certain chemical exposures.
Bostik Born2Bond UV-CIPG Gasketing solutions are designed to meet the needs of precision assembly in demanding industrial environments.
Features | Description |
Type of technology | Joint formé en place et polymérisé par UV, également appelé joint moulé par UV (UV-CIPG) |
Primary function | Creation of flexible seals for protection against water, dust, and environmental aggressions. |
Method of application | Automated or semi-automated dispensing using dispensing equipment. |
Polymerisation | Rapid curing by exposure to a UV source, without the need for a thermal oven. |
Mechanical properties | High flexibility, good elongation, and resistance to deformation. |
Compression behaviour | Formulation designed to limit the risk of cracking when the joint is compressed or deformed. |
Environmental resistance | Resistance to temperature fluctuations, humidity, dust, and certain chemicals depending on the chosen reference. |
Compatible substrates | Possible use on different industrial surfaces, including certain plastics, metals, glass or technical surfaces subject to prior validation. |
Industrial process | Compatible with automated lines, dispensing robots, micro-dispensing systems and complex geometries. |
Traditional seals can create significant constraints: storage of multiple references, dimensional tolerances, manual fitting operations, risk of incorrect positioning or the need for specific tooling. With a UV-CIPG solution, the seal is formed directly on the part, following a path defined by the dispensing process.
Automated dispensing produces a consistent bead, positioned along a pre-defined path. This precision is particularly useful for compact components, electronic enclosures, or parts with complex geometries, where the space available for the seal is limited.
Immediate polymerisation by UV light allows for a reduction in the time required between applying a sealant and handling the part. Unlike certain solutions that require a longer drying, curing, or stabilisation phase, UV-CIPG solutions can facilitate integration into high-speed production lines.
UV-CIPG seals are designed to retain their flexibility and withstand mechanical stresses related to compression, opening/closing, or dimensional variations. Their resistance to cracking helps maintain sealing function over time, subject to appropriate product selection and process validation.
In electronic enclosures, the challenge is to protect the internal components from moisture, dust and contaminants while maintaining a compact design. Bostik Born2Bond UV-CIPG Gasketing solutions allow a seal to be dispensed directly onto the contour of the enclosure, with a geometry adapted to the part.
In the automotive sector, electronic modules can be exposed to temperature variations, humidity, vibrations, or demanding environments. Formed-in-place gaskets can help protect components such as sensors, control units, ADAS modules, or electronic units.
Smart objects, smartwatches, wearable sensors, and compact devices often require thin, precise sealing solutions that are compatible with complex geometries. UV-CIPG gasketing allows for the formation of seals suited to small surfaces, with precise control over the dispensed volume.
For manufacturers of housings, enclosures and technical sub-assemblies, formed-in-place gaskets allow the sealing solution to be adapted to different part sizes, shapes or configurations. This flexibility is useful when product references change regularly or when volumes do not always justify specific moulded gaskets.
The choice of an industrial adhesive is not solely based on product performance. It also depends on its compatibility with materials, its behaviour during production, the application method, and the end-use constraints.
When working with a partner capable of combining product expertise Bostik This provides an understanding of industrial processes, manufacturers benefit from more comprehensive support. The objective is to propose an adhesive solution that is consistent with the technical requirement, but also realistic to integrate into a production environment.
A UV-CIPG, or UV Cure-In-Place Gasket, is a gasket formed directly on a part by depositing a liquid or paste-like material, which is then polymerised by exposure to UV light. In some cases, it replaces cut, moulded or manually assembled gaskets.
The main advantage is the ability to create a precise, flexible seal that is adapted to the part's geometry. UV curing allows for rapid hardening, which can reduce production times. This technology also limits the need for moulds, ovens, or large stocks of pre-cut seals.
Yes, these solutions are designed for use with automated or semi-automated dispensing systems. They can be integrated into production lines requiring precise, repeatable dispensing that is compatible with industrial speeds.
The range is particularly suitable for electronics, automotive, connected objects, technical enclosures, cameras, sensors, and assemblies requiring protection against water, dust, or environmental constraints.
Not always. The choice depends on the required level of waterproofing, the design of the part, the type of substrate, the usage conditions, and the industrial process. A testing phase is recommended to validate the compatibility of the solution with the final application.
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