Bostik Born2Bond UV epoxy adhesives are designed for industrial applications requiring precise dispensing, rapid curing, and reliable protection for sensitive components.
The Bostik Born2Bond UV-Epoxy adhesives range comprises UV-epoxy adhesives for applications where application precision, process control, and component protection are essential. Unlike some traditional epoxy systems, these formulations cure upon exposure to UV light, which avoids high thermal cycles and better protects heat-sensitive components.
These UV curable epoxy adhesives are particularly suited for electronic applications such as glob-top encapsulation, dam and fill processes, micro-chip protection, smart cards, sensors, and compact electronic modules. They enable the formation of a localised protective barrier against moisture, dust, and certain mechanical stresses, while also integrating into automated production processes.
The exact properties depend on the selected reference, the customer's process, and the application conditions. In general, the Bostik Born2Bond UV-Epoxy adhesives range can meet the following requirements:
Features | Description |
Type of technology | UV epoxy glue / cationic epoxy adhesive. |
Polymerisation technology | UV light curing. |
Method of application | Automated dispensing, dosing, localised deposit, or precision application. |
Polymerisation | Rapid curing by exposure to a UV source, without the need for a thermal oven. |
Application behaviour | Rheology adapted for deposit control and limiting spread outside the application area. |
Protection provided | Contribution to protection against humidity, dust, mechanical stress, and certain harsh environments. |
Thermal interest | Polymerisation without prolonged exposure to high temperatures, useful for sensitive components. |
Main applications | Electronic encapsulation, Glob Top, Dam & Fill, protection of microchips, smart cards and electronic modules. |
UV curing allows cross-linking to be initiated at the desired time, after the adhesive has been applied. This control over the curing time makes it easier to integrate UV epoxy adhesives into fast-paced production environments, particularly where parts need to move quickly from one assembly stage to the next.
Certain electronic applications do not allow the use of high temperatures, due to the sensitivity of microchips, connections, bonding wires or substrates. UV epoxy adhesives offer an interesting alternative, as their polymerisation by UV light can limit the thermal exposure of components.
Microelectronic applications often require controlled adhesive deposition onto small surfaces. The adhesive must remain within the targeted area, without spreading onto neighbouring components or impeding sub-assembly integration.
Bostik Born2Bond UV epoxy adhesives are suitable for precise dispensing and dosing applications. Their rheological properties allow for better control over the volume dispensed and the shape of the bead or dot of adhesive.
In an industrial setting, the performance of an adhesive depends as much on its technical properties as on its ability to be applied in a consistent and repeatable manner. UV epoxy adhesives can be integrated into automated dispensing equipment to standardise application, minimise variations and ensure production quality.
In smart cards, payment cards, ID badges, SIM cards and secure electronic modules, microchips and their connections must be protected against mechanical stress, moisture, dust and repeated handling.
The Bostik Born2Bond UV epoxy can be used for Glob Top encapsulation to locally cover the chip and connection wires. Precise dispensing protects the sensitive area without adding unnecessary material, while UV curing facilitates integration into a fast production process.
The Dam & Fill process involves creating a barrier around a sensitive electronic area and then filling that area with a resin or encapsulation adhesive. This approach is used when protection needs to be localised and the volume of material must be precisely controlled.
UV curable epoxy adhesives can meet this need due to their controlled dispensing capability and UV light curing. They allow for targeted protection, tailored to the geometric constraints of electronic components.
Smart cards and secure modules integrate electronic components that are exposed to stress from usage, handling, or the environment. Protecting sensitive areas is therefore essential to maintain product reliability over time.
Bostik Born2Bond UV epoxy adhesives can help secure these sub-assemblies by forming a localised protective layer on critical parts. This solution is relevant for manufacturers looking for a compromise between precision, cure speed, and functional protection.
The miniaturisation of electronic devices requires adhesive solutions that can be applied with precision to small surfaces. UV epoxy adhesives are well suited to these requirements, as they allow for localised application and rapid curing.
They can be used in compact devices, miniaturised electronic modules, wearables or sub-assemblies integrating sensitive components, where the application requires a high level of control.
The choice of a UV-curable epoxy adhesive depends on several parameters: nature of the substrates, deposition geometry, component sensitivity, production rate, environmental exposure, curing method and quality requirements of the finished product.
By combining Bostik’s product expertise with ADDEV Materials’s technical capabilities, manufacturers benefit from comprehensive support, from identifying the right solution through to its integration into the production process. This approach is particularly well suited to electronic, microelectronic and industrial applications where precision and reliability are critical.
A UV epoxy adhesive is an epoxy resin-based adhesive which cures when exposed to suitable UV light. This technology allows for control over the timing of curing and reduces cycle times compared to some traditional epoxy systems.
The Bostik Born2Bond UV-Epoxy adhesive range is used for precision applications such as electronic encapsulation, Glob Top, Dam & Fill, micro-chip protection, smart cards and sensitive electronic modules.
A classic epoxy adhesive may require a longer curing time or thermal activation. A UV epoxy adhesive cures under UV light, which allows for better process control and limited thermal exposure of sensitive components.
Yes, UV epoxy adhesives can be adapted for sensitive components, particularly when the application requires non-high-temperature curing, precise dispensing, and localised protection. However, the choice of reference must be validated according to the exact project constraints.
Yes, some UV epoxy glues are designed for glob-top applications. They allow for localised protection of a microchip, connection wires or a sensitive electronic area, while limiting the spread of adhesive outside the targeted zone.
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